SONY D3450

Thermal Bonding Tape for FPC Reinforcement Board, with unique thermal hardening system, it can be hardened in a short time compared with the previous thermal hardening products, and it has superb heat resistance:

It can correspond to the high temperature of tin furnace, and is suitable for bonding of FPC reinforcement board.
For PET, FR4, PI and other adhesives, it has very good adhesive strength.
It does not need to be refrigerated and can be kept at room temperature for half a year.
Suitable for vacuum press, fast press, transfer press and other machines.
It can be hardened in a short time, which can shorten the processing time.

SONY D3450 Data Sheet

Model	D3450
Main Ingredients	Acrylic/Epoxy
Base material	No substrate
Color	White color
Tape thickness (μm)	Approx. 35
Thickness of Release Film (μm)	approx. 38
Thickness of release paper (μm)	approx. 130
Adhesive strength (N/10mm)*¹	31
Standard size (width x length)	500mmx100m
Shelf life (from date of manufacture)	6 months

SONY D3450 Applications

It can correspond to the high temperature of tin furnace, and is suitable for bonding of FPC reinforcement boards.
Suitable for vacuum presses, quick presses, transfer presses and other machines.
Suitable for glass epoxy board, polyimide, aluminum plate, stainless steel plate and so on.
Applicable to FPC reinforcement boards (glass epoxy boards, polyimide, aluminum boards, stainless steel boards, etc.) that have thermal experiences such as reflow soldering.