SONY D3451

Thermal Bonding Tape for FPC Reinforcement Board, with unique thermal hardening system, it can be hardened in a short time compared with the previous thermal hardening products, and it has superb heat resistance:

1. It can correspond to the high temperature of tin furnace, and is suitable for bonding of FPC reinforcement board.
2. For PET, FR4, PI and other adhesives, it has very good adhesive strength.
3. It does not need to be refrigerated and can be kept at room temperature for half a year.
4. Suitable for vacuum press, fast press, transfer press and other machines.
5. It can be hardened in a short time, which can shorten the processing time.

1. It can correspond to the high temperature of tin furnace and is suitable for bonding of FPC reinforcement boards.
2. It has very good adhesion strength to PET, FR4, PI and other adhesives.
3. Does not require refrigeration and can be stored at room temperature for up to six months.
4. It can be hardened in a short period of time, which can shorten the processing time.

• Suitable for glass epoxy board, polyimide, aluminum plate, stainless steel plate and so on.
• Applicable to FPC reinforcement boards (glass epoxy boards, polyimide, aluminum boards, stainless steel boards, etc.) that have thermal experiences such as reflow soldering.